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Labtop case

Labtop case

Product Details

Layer Count8 layer HDI
Material TypeFR-4
PCB Thickness1.2MM
Outer copper thickness1.0oz
Minimum aperture0.3MM
Minimum width4/4mil
Pad platingImmersion Gold+OSP
Solder mask colorgreen
Silkscreenwhite
TestingAOI+AOI+Flying Probe Test
Solder mask coveragethrough via mask
Board size15*9CM
Use pcb materials建涛板材

Architecture design: Design a chip architecture, including core components such as central processing unit (CPU), graphics processing unit (GPU), memory controller, input/output controller, etc. CPUs need to have multiple cores to support high-performance computing. GPUs need to have powerful graphics processing capabilities to support games and multimedia applications. The memory controller needs to support DDR4 or higher memory specifications to achieve high-speed memory access. The input/output controller needs to support multiple interfaces, such as USB, HDMI, audio interface, etc.


Manufacturing process: Select a manufacturing process, such as 7nm or smaller nodes, to improve chip integration and performance. The manufacturing process requires the use of high-purity silicon wafers, and through photolithography, chemical etching, thin film deposition and other technologies, the circuit layers are superimposed on the silicon wafer layer by layer, and finally a complete chip is obtained through cutting, packaging, testing and other processes.


Power consumption optimization: Reduce chip power consumption through dynamic voltage adjustment technology, sleep state, power management unit, etc. For example, optimal energy utilization is achieved through technologies such as energy-saving algorithms, core shutdown, and intelligent power adjustment.


Thermal management: Use optimized thermal design, such as heat pipes, heat sinks, fans, etc., to ensure that the chip remains within a suitable temperature range. For example, the heat dissipation efficiency can be improved by dynamically controlling the fan speed and adjusting the position of the heat sink.


Security and Reliability: Chips are designed to ensure data security and reliability. For example, chips should support hardware-level encryption and authentication to prevent data theft or tampering. In addition, an automatic fault-tolerant function is designed to ensure chip reliability and stability.


Software support: The chip needs to provide appropriate software support to enable it to run operating systems and applications. For example, device drivers should be optimized to improve system performance. In addition, the chip design should support virtualization technology, enabling it to run multiple operating system instances.


In short, the above is our laptop chip design, the actual design will be more complex, requiring a lot of testing, simulation and optimization.


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