product
Specialty Laptop case

Specialty Laptop case

Product Details

Layer Count10 layer
Material TypeFR-4
Thickness1.2MM
Outer copper thickness1.0oz
minimum aperture0.2MM
minimum width4/4mil
Pad platingImmersion Gold+OSP
Solder mask colorgreen
Silkscreenwhite
testingAOI+AOI+Flying Probe Test
Solder mask coveragethrough via mask
board size13*8
Use pcb materialsFR-4

To design a special portable computer chip, many factors need to be considered, including power consumption, performance, size, communication interface, security and so on. Here is our design plan:


processor selection

Choose a processor with low power consumption and high performance, such as an ARM architecture processor. This reduces power consumption as much as possible while maintaining performance.


memory and storage

LPDDR4X memory and flash storage are used, which can increase data transmission speed and reduce power consumption.


Dimensions and Communication Interface

To compress the size of the chip as much as possible, BGA packaging can be considered. In addition, it needs to support multiple communication interfaces, such as USB, Wi-Fi, Bluetooth, etc., to meet the needs of various application scenarios.


safety

In order to ensure security, hardware encryption technology, such as AES encryption, can be used. In addition, a security module can be integrated inside the chip to realize functions such as identity authentication and data encryption.


other

You can consider integrating some commonly used peripherals inside the chip, such as cameras, audio chips, etc., for the convenience of designers.


It should be noted that the above solutions are for reference only, and the actual design needs to be combined with specific application scenarios and requirements to make an appropriate choice.


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