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Portable Workstation Case

Portable Workstation Case

Product Details

Layer Count8 layer HDI
Material TypeFR-4
Thickness1.2MM
Outer copper thickness1.0oz
minimum aperture0.3MM
minimum width4/4mil
Pad platingImmersion Gold+OSP
Solder mask colorblack
Silkscreenwhite
testingAOI+AOI+Test Frame
Solder mask coveragethrough via mask
board size18*8
Use pcb materialsFR-4

Portable workstation chips need to have the characteristics of high performance, high efficiency, and low power consumption. Here is our design proposal:


processor selection

Choose a processor with high performance and low power consumption, such as a processor with x86 or ARM architecture. Consider the processor's core count, frequency, and supported instruction sets to ensure adequate performance and functionality.


graphics card selection

Choose a high-performance discrete graphics card to ensure graphics rendering. At the same time, power consumption should be considered, and the technology of dynamically switching graphics cards can be adopted to automatically switch graphics cards according to application scenarios to save power consumption.


memory and storage

High-speed, large-capacity DDR4 memory and high-speed, large-capacity solid-state hard disk are used to meet the needs of high performance and large data volume. Consider the power consumption of memory and storage to ensure low power consumption and high performance.


Dimensions and Communication Interface

According to different application scenarios and user needs, the size of the chip and communication interfaces, such as USB, Ethernet, HDMI, etc., should be flexibly selected. Anti-interference ability and transmission speed should be considered to ensure stable data transmission.


safety

It is necessary to integrate a security module inside the chip to realize functions such as identity authentication and data encryption to ensure the security of user data. Hardware encryption technology can be used, such as AES encryption.


other

Some commonly used peripherals, such as cameras, audio chips, etc., can be integrated inside the chip for the convenience of designers. At the same time, the problem of heat dissipation should be considered, and efficient heat dissipation technology should be adopted to ensure the stability and reliability of the chip.


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